Liwei Wang
Director, 3D Advanced Packaging at AMD | Austin, Texas Metropolitan Area
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Director, 3D Advanced Packaging at AMD in June 2022 to Present
Principal Engineer/Director, Assembly and Test Program Manager - Intel3/4 Server/Networking Products at Intel Corporation in January 2020 to May 2022
Senior Technical Program Manager, Advanced 2.5D/3D Packaging Integration at Intel Corporation in July 2017 to December 2019
Senior Technical Program Manager, SiP Technology Integration at Intel Corporation in January 2015 to June 2017
Technical Program Manager, 3D Packaging Technology Integration at Intel Corporation in January 2014 to December 2014
Sr./Staff Packaging Engineer at Intel Corporation in October 2008 to December 2013
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Auburn University, Doctor of Philosophy (Ph.D.), January 2001 to January 2007
East China University of Science and Technology, Bachelor's degree, January 1997 to January 2001
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Characterization
Materials Science
Semiconductors
Design of Experiments
Failure Analysis
Thin Films
Simulations
SPC
Manufacturing
R&D
Semiconductor Industry
Research and Development (R&D)
Integrated Circuits (IC)
Statistical Process Control (SPC)
JMP
Matlab
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Discover more about AMDWhat is Liwei Wang email address?
Email Liwei Wang at [email protected] and [email protected]. This email is the most updated Liwei Wang's email found in 2025.
How to contact Liwei Wang?
To contact Liwei Wang send an email to [email protected] or [email protected].
What company does Liwei Wang work for?
Liwei Wang works for AMD
What is Liwei Wang's role at AMD?
Liwei Wang is Director, 3D Advanced Packaging
What is Liwei Wang's Phone Number?
Liwei Wang's phone (214) ***-*138
What industry does Liwei Wang work in?
Liwei Wang works in the Semiconductors industry.
Liwei Wang Email Addresses
Liwei Wang Phone Numbers
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